Within OHARA group we have OPC Corporation as a specialist for both side polished substrates and wafer. We process optical glass, glass-ceramic, borosilicate, fused silica and other materials. Sizes are from 4" to 8", thickness from 100 mm, round or square shape. We can do chamfers, orientation flat or notch, if requested with laser labeled customized numbers, as clear writing or barcode.

For further info please check the flyer (PDF). Please contact for your demand.